Application Solutions for Precision Fluid Dispensing
Application Solutions
Semiconductor/Component Packaging
- Hot Melt
- Dam and Fill / Glob Top / Encapsulation
- Solder Paste - MicroVolume
- Thermal Interface Materials
- Trench Filling
- Two Part Materials
- Wafer Processes
PCB Assembly
- Hot Melt
- Conductive Adhesive & Non-Conductive Adhesive
- Surface Mount Adhesive
- Solder Mask
- Solder Paste
- Flip Chip & BGA Underfill
- LED Encapsulation
- Underfill with PCD
- UV Curing
- Two Part Materials