Application Solutions for Precision Fluid Dispensing

Application Solutions

• Applications Overview

Semiconductor/Component Packaging

• Hot Melt
• Dam and Fill / Glob Top / Encapsulation
• Solder Paste - MicroVolume
• Thermal Interface Materials
• Trench Filling
• Two Part Materials
• Wafer Processes

PCB Assembly

• Hot Melt
• Conductive Adhesive & Non-Conductive Adhesive
• Surface Mount Adhesive
• Solder Mask
• Solder Paste
• Flip Chip & BGA Underfill
• LED Encapsulation
• Underfill with PCD
• UV Curing
• Two Part Materials

Solar

• Bus Bar/Conductive Fluids

Data Translation

• CircuitCAM Express Data Translator